Electroplated nickel gold is more commonly employed on IC substrates (for example PBGA), primarily for binding gold wires and copper wires; but when electroplating C substrates, extra conductive wires have to be manufactured with the gold finger binding put just before electroplating. Much more flexibility and dependability: Double-sided PCB will https://double-sided-tin-sprayed38260.wizzardsblog.com/31191407/ultrasound-machine-high-level-pcb-circuit-board-fundamentals-explained